In a fresh leak, tipster Digital Chat Station (DCS) is back with more details on Qualcomm’s next-gen flagship chip. Earlier this week, rumors suggested the Snapdragon 8 Elite Gen 6 could launch in two variants: a standard model and a Pro version. Now, DCS claims to have more specifics.
The tipster revealed that the Snapdragon 8 Elite Gen 6 will carry the model number SM8950, while the Gen 6 Pro will be designated SM8975. Both chips are rumored to be built on TSMC’s N2P, or 2nm, manufacturing process.
The hierarchy could be 8 Elige Gen 6, Dimensity 9600, and 8 Elite Gen 6 Pro
Meanwhile, DCS claims that MediaTek’s Dimensity 9600 slots in between the two Qualcomm chips. This technically means it will perform better than the vanilla 8 Elite Gen 6, but might not match the performance level of Pro.
However, unlike Qualcomm, MediaTek doesn’t appear to be planning multiple versions of its flagship just yet and is reportedly sticking with the trusted ARM CPU and architecture.
DCS also confirmed in the comments that the Dimensity 9600 will likely use the same 2nm TSMC process as Qualcomm’s upcoming chips.
It’s still unclear exactly what performance configuration the Dimensity 9600 will have to bridge the gap between the two Snapdragon models. For the Qualcomm chips, earlier reports suggest both will feature the company’s third-generation custom CPU architecture in a 2+3+3 core layout.
The main difference between the two Snapdragon variants seems to be in GPU performance, with only the Pro model expected to support LPDDR6 memory.
A separate report also hints that the advanced manufacturing process and faster memory could push up production costs, potentially making flagship phones even more expensive by 2027.
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